DocumentCode :
2155995
Title :
Modeling and simulation of a novel capacitive temperature sensor
Author :
Ma, HongYu ; Huang, Qing-An ; Qin, Ming ; Lu, TingTing
Author_Institution :
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China
fYear :
2008
fDate :
20-23 Oct. 2008
Firstpage :
2408
Lastpage :
2411
Abstract :
A novel capacitive temperature sensor based on multilayer cantilevers is presented. The top and bottom layers are metal and heavily boron doped Si, respectively. A combined SiO2/Si3N4 layer is utilized as the elastic dielectric layers of the sandwich multilayer cantilever. The operation principle of the structure is based on the effect of thermal expansion coefficient mismatch and the available physical effect of strain on the dielectric property. The deformation of the cantilever due to temperature is sensed and translated to an electrical capacitance change. After the structures of this sensor were designed, the mechanical characteristics of the sensor are theoretically analyzed with the extension of two-layer Timoshenko model. Calculation shows that, compared with traditional temperature sensors, the proposed structure may have a wider temperature range from -90°C to 90°C. This makes it suitable to act as air temperature sensor in radiosonde.
Keywords :
cantilevers; capacitive sensors; dielectric properties; silicon compounds; temperature sensors; thermal expansion; SiO2-Si3N4; air temperature sensor; capacitive temperature sensor; elastic dielectric layer; electrical capacitance; radiosonde; sandwich multilayer cantilever; temperature -90 degC to 90 degC; thermal expansion coefficient mismatch; two-layer Timoshenko model; Boron; Capacitance; Capacitive sensors; Dielectrics; Mechanical sensors; Nonhomogeneous media; Sensor phenomena and characterization; Temperature distribution; Temperature sensors; Thermal expansion;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
Conference_Location :
Beijing
Print_ISBN :
978-1-4244-2185-5
Electronic_ISBN :
978-1-4244-2186-2
Type :
conf
DOI :
10.1109/ICSICT.2008.4735056
Filename :
4735056
Link To Document :
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