Title :
Debug´ems and other Deconstruction Kits for STEM learning
Author :
Griffin, Jean ; Kaplan, Eliot ; Burke, Quinn
Author_Institution :
Dept. of Comput. & Inf. Sci., Univ. of Pennsylvania, Philadelphia, PA, USA
Abstract :
This concept paper presents Deconstruction Kits as a means of creatively engaging learners in problem solving and critical thinking, skills that are applicable to all STEM disciplines. Deconstruction Kits, designed to promote learning while being taken apart, use reverse engineering and debugging to enhance creativity in science, computer science, and engineering curriculum. Deconstruction Kits effectively complement Constructionist (learning-by-building) technologies such as Scratch, electronic textiles, Processing, and App Inventor for Android (referred to collectively in this paper as Construction Kits). Although Construction Kits appear to be effective in engaging novices in computing and electronics through personal and participatory expression, many teachers of AP and undergraduate computer science (CS) courses and engineering (EE) courses underestimate their value. Meanwhile on the K-12 level, opportunities to learn about computing and electronics are rare. Deconstruction Kits offer successful solutions to these concerns.
Keywords :
computer aided instruction; computer science education; engineering education; problem solving; Android; STEM learning; Scratch; app inventor; computer science; constructionist technologies; creativity enhancement; critical thinking; debugems; debugging; deconstruction kits; electronic textiles; engineering courses; engineering curriculum; participatory expression; personal expression; problem solving; reverse engineering; undergraduate computer science courses; Computer science education; Debugging; Educational institutions; Games; Problem-solving; Reverse engineering; Constructionism; Debug´em; Deconstruction Kits; Deconstructionism; STEM education; computer science education; debugging; electronic textiles;
Conference_Titel :
Integrated STEM Education Conference (ISEC), 2012 IEEE 2nd
Conference_Location :
Ewing, NJ
Print_ISBN :
978-1-4673-1097-0
DOI :
10.1109/ISECon.2012.6204168