DocumentCode
2156104
Title
Industry trends in power integrated circuits
Author
Robb, S.P. ; Sutor, J.L. ; Terry, L.
Author_Institution
Motorola Inc., Phoenix, AZ, USA
fYear
1988
fDate
11-14 Dec. 1988
Firstpage
792
Lastpage
795
Abstract
The authors consider some of the recent trends in power integrated circuits. They discuss the novel processes and device configurations which the semiconductor industry is developing to meet the needs of customers. Also included is a qualitative look at the design tradeoffs which influence the choice of technology for a particular application. The movement toward high-performance and higher-density circuitry, which demands smaller geometries and sophisticated processing, is also discussed. Particular attention is given to smart power (smart discrete devices and integrated circuits), multiple-output technology, high-voltage junction isolation, and high-voltage dielectric isolation.<>
Keywords
integrated circuit technology; power integrated circuits; HV type; design tradeoffs; device configurations; high-voltage dielectric isolation; high-voltage junction isolation; multiple-output technology; power integrated circuits; smart power; Costs; Diodes; Electronics industry; MOSFETs; Packaging; Power integrated circuits; Power system protection; Switches; Thermal stresses; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
Conference_Location
San Francisco, CA, USA
ISSN
0163-1918
Type
conf
DOI
10.1109/IEDM.1988.32930
Filename
32930
Link To Document