• DocumentCode
    2156104
  • Title

    Industry trends in power integrated circuits

  • Author

    Robb, S.P. ; Sutor, J.L. ; Terry, L.

  • Author_Institution
    Motorola Inc., Phoenix, AZ, USA
  • fYear
    1988
  • fDate
    11-14 Dec. 1988
  • Firstpage
    792
  • Lastpage
    795
  • Abstract
    The authors consider some of the recent trends in power integrated circuits. They discuss the novel processes and device configurations which the semiconductor industry is developing to meet the needs of customers. Also included is a qualitative look at the design tradeoffs which influence the choice of technology for a particular application. The movement toward high-performance and higher-density circuitry, which demands smaller geometries and sophisticated processing, is also discussed. Particular attention is given to smart power (smart discrete devices and integrated circuits), multiple-output technology, high-voltage junction isolation, and high-voltage dielectric isolation.<>
  • Keywords
    integrated circuit technology; power integrated circuits; HV type; design tradeoffs; device configurations; high-voltage dielectric isolation; high-voltage junction isolation; multiple-output technology; power integrated circuits; smart power; Costs; Diodes; Electronics industry; MOSFETs; Packaging; Power integrated circuits; Power system protection; Switches; Thermal stresses; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
  • Conference_Location
    San Francisco, CA, USA
  • ISSN
    0163-1918
  • Type

    conf

  • DOI
    10.1109/IEDM.1988.32930
  • Filename
    32930