DocumentCode :
2156104
Title :
Industry trends in power integrated circuits
Author :
Robb, S.P. ; Sutor, J.L. ; Terry, L.
Author_Institution :
Motorola Inc., Phoenix, AZ, USA
fYear :
1988
fDate :
11-14 Dec. 1988
Firstpage :
792
Lastpage :
795
Abstract :
The authors consider some of the recent trends in power integrated circuits. They discuss the novel processes and device configurations which the semiconductor industry is developing to meet the needs of customers. Also included is a qualitative look at the design tradeoffs which influence the choice of technology for a particular application. The movement toward high-performance and higher-density circuitry, which demands smaller geometries and sophisticated processing, is also discussed. Particular attention is given to smart power (smart discrete devices and integrated circuits), multiple-output technology, high-voltage junction isolation, and high-voltage dielectric isolation.<>
Keywords :
integrated circuit technology; power integrated circuits; HV type; design tradeoffs; device configurations; high-voltage dielectric isolation; high-voltage junction isolation; multiple-output technology; power integrated circuits; smart power; Costs; Diodes; Electronics industry; MOSFETs; Packaging; Power integrated circuits; Power system protection; Switches; Thermal stresses; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1988. IEDM '88. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Type :
conf
DOI :
10.1109/IEDM.1988.32930
Filename :
32930
Link To Document :
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