• DocumentCode
    2156485
  • Title

    Fabrication and test of the planar microcoil for NMR spectroscopy of samples in nL level

  • Author

    Li, Xiaonan ; Wang, Ming ; Song, Tao ; Yang, Wenhui

  • Author_Institution
    Inst. of Electr. Eng., Chinese Acad. of Sci., Beijing, China
  • fYear
    2008
  • fDate
    20-23 Oct. 2008
  • Firstpage
    2492
  • Lastpage
    2495
  • Abstract
    We present the optimal planar microcoils with inner radius in several hundreds of microns. The microcoils are used in the RF transceiver probe in NMR experiment. At a certain condition of experiment the geometry of microcoil is optimized by analytic simulation about the signal-to-noise ratio while varying the number of turns. The fabrication of microcoils has been finished by photolithography technique and copper electroplating. The SU-8 photoresist which features to form high-aspect ratio structure was used for constructing the mold utilized in copper electroplating. It is simple in our process that there is only including one electroplating step. The RF performance of planar microcoils fabricated has been test by impedance analyzer Agilent 4294 in the Agilent Open Lab in Beijing. For the microcoil of No. 500_3 on Sub.2, the measured RF inductance is 76.5 nH, and Q-factor 12.9. The comparison with the reports of other scholars has been performed. And the electronics setup used for NMR respond signal measurement is introduced.
  • Keywords
    NMR spectroscopy; Q-factor; copper; electroplating; impedance matching; integrated circuit testing; photolithography; photoresists; solenoids; transceivers; NMR spectroscopy; Q-factor; RF inductance; RF transceiver; SU-8 photoresist; copper electroplating; photolithography; planar microcoil; signal-to-noise ratio; Copper; Fabrication; Geometry; Nuclear magnetic resonance; Probes; Radio frequency; Signal analysis; Spectroscopy; Testing; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2185-5
  • Electronic_ISBN
    978-1-4244-2186-2
  • Type

    conf

  • DOI
    10.1109/ICSICT.2008.4735077
  • Filename
    4735077