The flip-chip mounted MMIC technology using the modified MCM-D substrate for compact and low-cost W-band transceiver

We present novel multi-chip module (MCM)-D technology to improve the mechanical and thermal properties of a MCM-D substrate for a motherboard of the flip-chip structure. Advantages of the flip-chip mounted MMIC technology using the modified MCM-D substrate were investigated. Based on this investigation, the W-band CPW MMIC amplifier using the 0.1-μm GaAs pHEMT was successfully mounted on the modified MCM-D substrate by means of the flip-chip technology. Moreover, the W-band down-converter module with internal local oscillator (LO) source was realized with this technology.