Title :
An improved packaging technology for RF power transistors
Author :
McCarthy, Simon ; Smith, Phil ; Walker, John ; Padfield, Nick
Author_Institution :
SEMELAB plc, Lutterworth, UK
Abstract :
This paper presents an improved packaging technology for RF power transistors that is beryllia-free and which halves the thermal resistance compared with the conventional approach. This new technology also reduces the source inductance and increases the gain.
Keywords :
microwave power transistors; semiconductor device packaging; thermal resistance; RF power transistors; beryllia-free packaging; packaging technology; source inductance; thermal resistance; Conducting materials; Flanges; Inductance; Packaging; Power MOSFET; Power transistors; Radio frequency; Silicon; Thermal conductivity; Thermal resistance;
Conference_Titel :
Microwave Symposium Digest, 2005 IEEE MTT-S International
Print_ISBN :
0-7803-8845-3
DOI :
10.1109/MWSYM.2005.1516841
