• DocumentCode
    2157335
  • Title

    Leakage, Crosstalk and Package Effects in Millimeter-Wave Integrated Circuits

  • Author

    Oliner, Arthur A.

  • Author_Institution
    Polytechnic University, Brooklyn, New York, USA. aao@merrimacind.com
  • fYear
    2000
  • fDate
    Oct. 2000
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Spurious effects in millimeter-wave packages can include crosstalk, power loss or ripples along the line, and coupling between lines. The mechanisms causing these effects can be the excitation of surface waves or parallel-plate substrate modes, or wave leakage from the dominant mode on the circuit´s transmission lines, or the presence of additional modes on these lines. The talk will discuss all of these mechanisms, but will focus on wave leakage because the results are newer and also less well known. The focus in this talk, however, is on what types of changes can arise when these lines are placed in a package. It is important to note that the effects due to the presence of the top cover are quite different from those due to the side walls.
  • Keywords
    Circuit optimization; Coupling circuits; Crosstalk; Distributed parameter circuits; Integrated circuit packaging; Microwave integrated circuits; Millimeter wave integrated circuits; Power transmission lines; Surface waves; Transmission line discontinuities;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2000. 30th European
  • Conference_Location
    Paris, France
  • Type

    conf

  • DOI
    10.1109/EUMA.2000.338843
  • Filename
    4139856