Application oriented MEMS by open collaboration

Author

Esashi, Masayoshi

Author_Institution

World Premier Int. Res. Center Adv. Inst. for Mater. Res., Tohoku Univ. Sendai, Sendai, Japan

fYear

2008

fDate

20-23 Oct. 2008

Firstpage

7

Lastpage

12

Abstract

Silicon MEMS as electrostatically levitated rotational gyroscope and 2D optical scanner, and wafer level packaged devices as integrated capacitive pressure sensor and MEMS swatch are described. MEMS which use non-silicon materials as diamond, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO₃ for multi-probe data storage, multi-column electron beam lithography system, probe card for wafer-level burn-in test, mold for glass press molding and SAW wireless passive sensor respectively are also described.

Keywords

carbon nanotubes; ceramic packaging; electron beam lithography; gyroscopes; lithium compounds; micromechanical devices; microsensors; microswitches; optical scanners; silicon compounds; surface acoustic wave sensors; 2D optical scanner; CNT; LTCC; LiNbO₃; MEMS switch; SAW wireless passive sensor; Si; SiC; application oriented MEMS; carbon nanotube; diamond; electrostatically levitated rotational gyroscope; glass press molding; integrated capacitive pressure sensor; multi-column electron beam lithography system; multi-probe data storage; nonsilicon materials; probe card; silicon MEMS; silicon carbide; wafer level packaged devices; wafer-level burn-in test; Collaboration; Electron optics; Gyroscopes; Integrated optics; Micromechanical devices; Optical devices; Optical sensors; Sensor phenomena and characterization; Silicon carbide; Wafer scale integration;

fLanguage

English

Publisher

ieee

Conference_Titel

Solid-State and Integrated-Circuit Technology, 2008. ICSICT 2008. 9th International Conference on

Conference_Location

Beijing

Print_ISBN

978-1-4244-2185-5

Electronic_ISBN

978-1-4244-2186-2

Type

conf

DOI

10.1109/ICSICT.2008.4735114

Filename

4735114