• DocumentCode
    2160128
  • Title

    Multi-dimensional model reduction of VLSI interconnects

  • Author

    Gunupudi, Pavan ; Nakhla, Michel

  • Author_Institution
    Dept. of Electron., Carleton Univ., Ottawa, Ont., Canada
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    499
  • Lastpage
    502
  • Abstract
    Recently there have been numerous publications for developing reduced-order macromodels for linear circuits. However, all these techniques perform model reduction with respect to a single parameter such as frequency. This paper presents a new technique to reduce the order of the linear system simultaneously with respect to multiple parameters. The reduction is based on multidimensional congruence transformation. The proposed algorithm provides efficient means to estimate the response of large circuits simultaneously as a function of frequency and other design parameters
  • Keywords
    VLSI; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; network parameters; reduced order systems; VLSI interconnects; design parameters; large circuits; linear system; multi-dimensional model reduction; multidimensional congruence transformation; multiple parameters; reduced-order macromodels; Circuit simulation; Computer networks; Ear; Equations; Frequency estimation; Integrated circuit interconnections; Linear systems; Reduced order systems; Very large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Custom Integrated Circuits Conference, 2000. CICC. Proceedings of the IEEE 2000
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-5809-0
  • Type

    conf

  • DOI
    10.1109/CICC.2000.852717
  • Filename
    852717