Title :
Testability considerations
Author :
Sun, Shang-Zhi ; Du, David H C ; Liu, Duen-Ren
Author_Institution :
Dept. of Comput. Sci., Minnesota Univ., Minneapolis, MN, USA
Abstract :
Single-fault, multi-fault, 0-1 static sensitizable path, and robust path delay fault are often used to measure the testability of a circuit. We explore the relationships among these testabilities. In addition to the relationships discovered before, we prove that 100% single fault testability, 100% 0-1 static sensitizability are equivalent in two-level single-output circuits. We also prove that 100% 0-1 static sensitizability implies 100% multi-fault testability, and that 100% robust path delay fault testability implies 100% multi-fault testability in two-level circuits. Several new conditions for gate merging while keeping 100% single-fault testability are presented. We further prove that the three transformations D1,1,2 (J. Rajski and J. Vasudevamurthy, 1992), extraction, De-Morgan keeping 100% single fault testability also preserve 100% multiple-fault testability, 100% multi-fault testability, 100% robust path delay fault testability. We answer the following two open questions: does 100% multi-fault testability in a multiple outputs circuit not require 100% 0-1 static sensitizability? Does 100% multi-fault testability in a single output circuit imply 100% 0-1 static sensitizability?
Keywords :
design for testability; logic design; logic testing; 0-1 static sensitizability; 0-1 static sensitizable path; circuit testability; gate merging; multi-fault testability; robust path delay fault; robust path delay fault testability; single fault testability; testability considerations; two-level single-output circuits; Circuit faults; Circuit synthesis; Circuit testing; Delay; Integrated circuit synthesis; Integrated circuit testing; Merging; Robustness; Sun;
Conference_Titel :
Computer Design: VLSI in Computers and Processors, 1994. ICCD '94. Proceedings., IEEE International Conference on
Conference_Location :
Cambridge, MA
Print_ISBN :
0-8186-6565-3
DOI :
10.1109/ICCD.1994.331863