A novel double-side heat-removing laser structure for very high efficiency and high power lasers

Thermal design is known to be very important in high-power opto-electronic packaging. Efficient heat removing arrangement can greatly improve the device performance including the maximum output power, which is closely related to the junction and heat sink temperature difference, and the device lifetime, which strongly depends on the built-in thermal stress. A novel double-side heat-removing structure is proposed to reduce the junction and the heat sink temperature difference to a few degree K. Theoretic analysis and simulation results are presented.