DocumentCode
2161116
Title
Design of fiber stick chips and its application to the Michelson interferometer
Author
Nobuyoshi, Terumi
Author_Institution
Okayama-Rika Univ., Okayama, Japan
fYear
2004
fDate
19-20 Oct. 2004
Firstpage
27
Lastpage
32
Abstract
A novel fiber stick chip is designed by assembling and stacking functional fiber sticks as building blocks. Stick components in this optoelectronic packaging are composed of two types of fiber-like sticks. The first type consists of the functional short optical fibers used for amplifying, filtering, or interconnecting. The second type includes shape memory alloy sticks used for switching and phase-shifting. Referring to the optical circuit; the right-angled fiber-to-fiber coupling, the side-by-side coupling, the transverse propagating, and the optical power dividing all play an important role in the 2 or 3-dimensional interconnecting. Two examples, including Michelson interferometer chips, are shown.
Keywords
assembling; integrated optoelectronics; light interferometers; optical design techniques; optical fibre couplers; optical fibre filters; optical interconnections; optical phase shifters; optical switches; packaging; shape memory effects; stacking; 2-dimensional interconnecting; 3-dimensional interconnecting; Michelson interferometer; Michelson interferometer chips; assembling; fiber stick chip design; fiber stick chips; fiber-like sticks; functional fiber sticks; optical amplification; optical circuit; optical filtering; optical interconnection; optical phase-shifting; optical power dividing; optical switching; optoelectronic packaging; right-angled fiber-to-fiber coupling; shape memory alloy sticks; short optical fibers; side-by-side coupling; stacking; transverse propagation; Assembly; Coupling circuits; Integrated circuit interconnections; Optical coupling; Optical fibers; Optical filters; Optical interconnections; Optical interferometry; Stacking; Stimulated emission;
fLanguage
English
Publisher
ieee
Conference_Titel
Lightwave Technologies in Instrumentation and Measurement Conference, 2004. Proceedings of the
Print_ISBN
0-7803-8722-8
Type
conf
DOI
10.1109/LTIMC.2004.1370984
Filename
1370984
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