DocumentCode :
2161706
Title :
Silicon OEICs with optical switching and amplification capability
Author :
Sun, Y. ; Yu, X. ; Ji, X. ; Choa, F.S.
Author_Institution :
Maryland Univ., Baltimore, MD, USA
fYear :
2004
fDate :
19-20 Oct. 2004
Firstpage :
130
Lastpage :
134
Abstract :
New methods to integrate InP based active devices with Si based passive waveguide is proposed. Using evanescent wave coupling between waveguides and flip-chip bonding techniques we can build seamless interface between silicon waveguides and broadband InP gain materials. The beam propagation method (BPM) was used to analyze and simulate the integrated structure. The simulation shows that the coupling efficiency is determined by waveguide taper length, taper angle, taper thickness, separation distance between InP waveguide core and Si waveguide core, effective index and growth thickness of InP taper, and offset between two waveguide tapers. After optimizing these parameters, 80% coupling efficiency is achieved. A second method using U-shape semiconductor optical amplifiers (SOAs) to connect waveguides and avoid double side coupling issues will also be discussed.
Keywords :
III-V semiconductors; flip-chip devices; indium compounds; integrated optics; integrated optoelectronics; optical couplers; optical switches; optical waveguides; semiconductor device models; semiconductor optical amplifiers; silicon; silicon-on-insulator; InP based active devices; InP gain materials; InP taper; InP waveguide; InP-Si; SOI; Si based passive waveguide; U-shaped SOA; amplification capability; beam propagation method; broadband gain materials; coupling efficiency; device integration; evanescent wave coupling; flip-chip bonding; optical switching; seamless interface; semiconductor optical amplifiers; silicon OEIC; silicon waveguides; waveguide tapers; Analytical models; Bonding; Indium phosphide; Optical materials; Optical propagation; Optical surface waves; Optical waveguides; Semiconductor waveguides; Silicon; Stimulated emission;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Lightwave Technologies in Instrumentation and Measurement Conference, 2004. Proceedings of the
Print_ISBN :
0-7803-8722-8
Type :
conf
DOI :
10.1109/LTIMC.2004.1371009
Filename :
1371009
Link To Document :
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