• DocumentCode
    2162893
  • Title

    How deep sub micron will boost Internet appliances in the digital home network

  • Author

    Danneels, J.

  • Author_Institution
    Alcatel Microelectron., Brussels, Belgium
  • fYear
    2001
  • fDate
    2-5 Dec. 2001
  • Abstract
    Internet access at home has been limited to PCs using V.90 dial-up modems. However, the current uptake of broadband DSL modems and the move towards digital home networking are turning Internet access into a shared resource available throughout the whole home. As a result, any home appliance connected to the digital home network will over time become an Internet appliance. The key drivers behind this evolution are the deployment of residential gateways and simple-to-use home networks. The residential gateway is the demarcation point between the public and the home network. It manages the shared Internet access among the different Internet appliances and it combines broadband modem technology, digital home networking, and network interworking technology in a single box. Deep submicron CMOS integration and first-time-right system-on-chip (SoC) design approaches are essential to move residential gateways to consumer-level price points in ever shorter time-to-market windows. Consequently, an SoC vendor has to cope with a multitude of challenges to be successful in the digital home network market.
  • Keywords
    CMOS digital integrated circuits; Internet; ULSI; application specific integrated circuits; digital subscriber lines; modems; CMOS; Internet appliances; SoC design; broadband DSL modems; deep sub micron technology; digital home network; home appliance; network interworking technology; residential gateways; shared Internet access; shared resource; time-to-market windows; CMOS technology; DSL; Home appliances; Home automation; IP networks; Internet; Modems; Personal communication networks; Technology management; Turning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-7050-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2001.979361
  • Filename
    979361