Title :
On the millimeter-wave characteristics and model of on-chip interconnect transmission lines up to 110 GHz
Author :
Yang, M.T. ; Ho, Patricia P C ; Yeh, T.J. ; Wang, Y.J. ; Kuo, Darryl C W ; Kuo, C.W. ; Yang, S.C. ; Mangan, Alain ; Voinigescu, Sorin P. ; Liu, Sally
Author_Institution :
TSMC, Hsinchu, Taiwan
Abstract :
On-chip microstrip and coplanar waveguide structures were designed and fabricated in RF CMOS foundry processes. The wideband transmission line characteristics such as characteristic impedance, attenuation constant, propagation delay, and their electrical RLC parameters were evaluated based on S-parameter measurements in the millimeter-wave range. In addition, a SPICE-compatible RLC lumped element model including the skin-effect and the substrate RC network is employed to account for transmission line effects in interconnect over a wide frequency range up to 110 GHz.
Keywords :
RLC circuits; S-parameters; coplanar waveguides; integrated circuit interconnections; integrated circuit modelling; lumped parameter networks; microstrip lines; millimetre wave measurement; skin effect; RF CMOS process; RLC lumped element model; S-parameter measurements; attenuation constant; characteristic impedance; electrical RLC parameters; inductance model; millimeter-wave characteristics; on-chip coplanar waveguide; on-chip interconnect transmission lines; on-chip microstrip structures; propagation delay; skin effect; substrate RC network; transmission line effects; wideband transmission line characteristics; CMOS process; Coplanar transmission lines; Coplanar waveguides; Foundries; Microstrip; Millimeter wave measurements; Millimeter wave propagation; Radio frequency; Semiconductor device modeling; Transmission lines;
Conference_Titel :
Microwave Symposium Digest, 2005 IEEE MTT-S International
Print_ISBN :
0-7803-8845-3
DOI :
10.1109/MWSYM.2005.1517080
