• DocumentCode
    2164244
  • Title

    Theoretical analyses of chemical reactions for forming hydrocarbon-bridged SiOCH low-k Films in PECVD processes

  • Author

    Tajima, N. ; Ohashi, Y. ; Nagano, S. ; Xu, Y. ; Matsumoto, S. ; Kada, T. ; Ohno, T.

  • Author_Institution
    Nat. Inst. for Mater. Sci., Tsukuba
  • fYear
    2009
  • fDate
    1-3 June 2009
  • Firstpage
    116
  • Lastpage
    118
  • Abstract
    The advantages of the SiOCH low-k films with hydrocarbon cross-links (hydrocarbon bridges) Si-Cn-Si have been reported recently. However, hydrocarbon cross-links are not produced so selectively by the PECVD method, since the hydrocarbon components tend to form terminal atom groups such as Si-CH3. For producing hydrocarbon cross-links effectively by the PECVD method, the polymerization reactions of SiOCH precursors in the PECVD process should be understood well. We have theoretically examined the bonding reactions of the atom groups of SiOCH compounds. By examining the reactions involving radicals and ions, it has been found that the radical species Simiddot, Cmiddot, and Omiddot produce Si-O, C-Si, and O-Si bonds, respectively, while the ionic species produce Si-O bonds. These results suggest that the precursors should produce Si-Cnmiddot radicals preferably for the effective production of the hydrocarbon cross-links.
  • Keywords
    bonding processes; low-k dielectric thin films; plasma CVD; polymerisation; silicon compounds; O-Si bond; PECVD processes; SiOCH; atom groups; bonding reactions; chemical reactions; hydrocarbon cross-links; hydrocarbon-bridged low-k films; polymerization reactions; radical species; Atomic measurements; Bonding; Bridges; Chemical analysis; Chemical processes; Dielectric constant; Energy barrier; Hydrocarbons; Polymers; Production;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Interconnect Technology Conference, 2009. IITC 2009. IEEE International
  • Conference_Location
    Sapporo, Hokkaido
  • Print_ISBN
    978-1-4244-4492-2
  • Electronic_ISBN
    978-1-4244-4493-9
  • Type

    conf

  • DOI
    10.1109/IITC.2009.5090357
  • Filename
    5090357