• DocumentCode
    2164602
  • Title

    Weibull slopes, critical defect density, and the validity of stress-induced-leakage current (SILC) measurements

  • Author

    Wu, E.Y. ; Sune, J. ; Nowak, E. ; Lai, W. ; McKenna, J.

  • Author_Institution
    Microelectron. Div., IBM Co., Essex Junction, VT, USA
  • fYear
    2001
  • fDate
    2-5 Dec. 2001
  • Abstract
    Voltage, temperature, and polarity dependence of Weibull slopes are carefully measured using area scaling method over a wide range of voltages and temperatures for several oxide thickness (T/sub OX/) values in comparison with direct method. We investigate the validity of stress-induced-leakage-current (SILC), /spl Delta/J/J/sub 0|BD/, as a measure for the critical defect density, N/sub BD/. Our finding clearly shows that the /spl Delta/J/J/sub 0|BD/ cannot be used as a reliable measure of N/sub BD/. This work suggests that a re-evaluation of the breakdown models constructed from the SILC-based measurements is required in gate oxide reliability community, in particular, their validity in comparison with the statistically accurate breakdown data.
  • Keywords
    Weibull distribution; electric current measurement; leakage currents; semiconductor device breakdown; semiconductor device measurement; semiconductor device reliability; Weibull slope; area scaling method; breakdown model; critical defect density; direct method; gate oxide reliability; oxide thickness; polarity dependence; stress-induced-leakage current measurement; temperature dependence; voltage dependence; Area measurement; Breakdown voltage; Current measurement; Density measurement; Electric breakdown; Microelectronics; Stress measurement; Temperature dependence; Temperature distribution; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-7050-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2001.979448
  • Filename
    979448