• DocumentCode
    2165834
  • Title

    Low-Loss Microstrip MEMS Technology for RF Passive Components

  • Author

    Martoglio, L. ; Richalot, E. ; Picon, O. ; Lissorgues-Bazin, G. ; Vasseure, C.

  • Author_Institution
    Université Marne-la-Vallée, Bâtiment Lavoisier, rue Galilée, 77420 Champs-sur-Marne - France, 01.60.95.72.79, lmartogl@univ-mlv.fr
  • fYear
    2001
  • fDate
    24-26 Sept. 2001
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A new low loss and low cost microstrip MEMS technology is presented. Two inverted microstrip lines, one on low loss silicon and the other on glass have been measured and simulated. A good concordance of the results has been obtained. Simulations have been used to study the influence of several parameters, and the results of simulations allow us to adjust the lines dimensions to prescribed characteristics.
  • Keywords
    CMOS technology; Conductivity; Costs; Glass; Impedance; Micromechanical devices; Microstrip components; Radio frequency; Silicon; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2001. 31st European
  • Conference_Location
    London, England
  • Type

    conf

  • DOI
    10.1109/EUMA.2001.339124
  • Filename
    4140192
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2165834