• DocumentCode
    2166114
  • Title

    Packaged Millimeter Wave Thermal MEMS Switches

  • Author

    Blondy, P. ; Mercier, D. ; Cros, D. ; Guillon, P. ; Rey, P. ; Charvet, P. ; Diem, B. ; Zanchi, C. ; Lapierre, L. ; Sombrin, J. ; Quoirin, J.-B.

  • Author_Institution
    IRCOM, Faculté des Sciences, 123 avenue A. Thomas, 87000 LIMOGES FRANCE. Tel: 05 55 45 77 31 - Fax: 05 55 45 76 49 - email: pblondy@ircom.unilim.fr
  • fYear
    2001
  • fDate
    24-26 Sept. 2001
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    This abstract describes MEMS thermally actuated millimeter wave switches. The switches are constructed using a stress controlled dielectric membrane, with patterned metallic contacts. The resulting switches can be operated at low voltage, without sacrificing the spring constant. The structure allows to build resistive switches up to millimeter wave. Full wave simulations were performed using FEM and MoM codes, and agree well with measurements. A wafer scale packaging technique has been developed to protect the components during the dicing stage, and for long term durability. The measured isolation are better than 35 dB between 30 and 40 GHz.
  • Keywords
    Biomembranes; Dielectrics; Low voltage; Micromechanical devices; Microswitches; Millimeter wave technology; Packaging; Stress control; Switches; Thermal stresses;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2001. 31st European
  • Conference_Location
    London, England
  • Type

    conf

  • DOI
    10.1109/EUMA.2001.339133
  • Filename
    4140201
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2166114