• DocumentCode
    2166155
  • Title

    Data retention time in DRAM with WSi/sub x//P/sup +/poly-Si gate NMOS cell transistors

  • Author

    Kujirai, H. ; Ohyu, K. ; Moniwa, M. ; Kato, H. ; Nakai, K. ; Iwai, H. ; Nanba, M. ; Ogishima, A.

  • fYear
    2001
  • fDate
    2-5 Dec. 2001
  • Abstract
    A 64-Mbit DRAM with WSi/sub x//P/sup +/poly-Si gate NMOS cell transistors (P+gate DRAM) has been developed to improve the DRAM data retention time of the tail-distribution. The data retention time that corresponds to 0.01% failure bit in the cumulative probability of the P+gate DRAM is 2.7 times longer than that of conventional N+gate DRAMs. The main reason for the improved data retention time is that the low channel-doping level, achieved by the P+gate DRAM, reduces the electric field at around 0.04 /spl mu/m depth below the surface.
  • Keywords
    CMOS memory circuits; DRAM chips; MOSFET; doping profiles; integrated circuit reliability; low-power electronics; 64 Mbit; 64-Mbit DRAM; WSi/sub x/-Si; WSi/sub x//P/sup +/poly-Si gate NMOS cell transistors; cumulative probability; data retention time; electric field reduction; failure bit; low channel-doping level; power consumption; tail-distribution; Circuits; Doping; Electrodes; Energy consumption; Leakage current; MOS devices; MOSFETs; Random access memory; Ultra large scale integration; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 2001. IEDM '01. Technical Digest. International
  • Conference_Location
    Washington, DC, USA
  • Print_ISBN
    0-7803-7050-3
  • Type

    conf

  • DOI
    10.1109/IEDM.2001.979520
  • Filename
    979520