• DocumentCode
    2166654
  • Title

    Embedding Current Monitoring in H-Tree RAM Architecture for Multiple SEU Tolerance and Reliability Improvement

  • Author

    Argyrides, Costas ; Vargas, Fabian ; Moraes, Marlon ; Pradhan, Dhiraj K.

  • Author_Institution
    Dept. of Comput. Sci., Univ. of Bristol, Bristol
  • fYear
    2008
  • fDate
    7-9 July 2008
  • Firstpage
    155
  • Lastpage
    160
  • Abstract
    In this paper, we present a new technique to improve the reliability of H-tree SRAM memories. This technique deals with the SRAM power-bus monitoring by using built-in current sensor (BICS) circuits that detect abnormal current dissipation in the memory power-bus. This abnormal current is the result of a single-event upset (SEU) in the memory and it is generated during the inversion of the state of the memory cell being upset. The current checking is performed on an H-tree SRAM in different ways. We demonstrate the assertions of the proposed technique by performing a reliability analysis while combining current monitoring with a single-parity bit or Hamming codes per RAM word to perform single or multiple error correction.
  • Keywords
    Hamming codes; SRAM chips; error correction codes; integrated circuit reliability; H-tree RAM architecture; H-tree SRAM memories; Hamming codes; SEU reliability; SRAM power-bus monitoring; abnormal current dissipation; built-in current sensor circuits; current monitoring; memory power-bus; multiple SEU tolerance; multiple error correction; reliability analysis; single error correction; single-event upset; single-parity bit codes; Binary trees; Computerized monitoring; Cosmic rays; Energy consumption; Error correction codes; Microprocessors; Random access memory; Read-write memory; Single event upset; Testing; Built-In Current Sensor (BICS); Error Correcting Codes; Fault-tolerant SRAM; Low-Power Design; Memory Design; Yield Improvement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    On-Line Testing Symposium, 2008. IOLTS '08. 14th IEEE International
  • Conference_Location
    Rhodes
  • Print_ISBN
    978-0-7695-3264-6
  • Type

    conf

  • DOI
    10.1109/IOLTS.2008.36
  • Filename
    4567078