• DocumentCode
    2167
  • Title

    Design of a Temperature-Aware Low-Voltage SRAM With Self-Adjustable Sensing Margin Enhancement for High-Temperature Applications up to 300 °C

  • Author

    Kim, Tony Tae-Hyoung ; Ngoc Le Ba

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
  • Volume
    49
  • Issue
    11
  • fYear
    2014
  • fDate
    Nov. 2014
  • Firstpage
    2534
  • Lastpage
    2546
  • Abstract
    This paper presents an 8-Kbit low-power SRAM for high-temperature (up to 300°C) applications. For reliable low-voltage operation, we employed a decoupled 8T SRAM cell structure. To minimize the performance variations caused by the wide operating temperate range, supply voltage was selected in the near-threshold region. A temperature-aware bitline sensing margin enhancement technique is proposed to mitigate the impact of significantly increased bitline leakage on bitline swing and sensing window. A temperature-tracking control circuit generates bias voltage for optimal pull-up current for realizing the proposed enhancement technique. Test chips were fabricated in a commercial 5 V, 1.0 μm SOI technology. Test chip measurement demonstrates successful operation down to 2 V at 300°C. The average energy of 0.94 pJ was achieved at 2 V and 300°C.
  • Keywords
    SRAM chips; low-power electronics; silicon-on-insulator; SOI; SRAM; energy 0.94 pJ; self-adjustable sensing margin enhancement; size 1.0 mum; temperature 300 C; temperature-aware bitline sensing margin enhancement technique; temperature-tracking control circuit; voltage 2 V; voltage 5 V; Reliability; SRAM cells; Temperature distribution; Temperature sensors; Bitline leakage; SOI technology; bitline sensing margin; high temperature; low-voltage SRAM; temperature-aware;
  • fLanguage
    English
  • Journal_Title
    Solid-State Circuits, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    0018-9200
  • Type

    jour

  • DOI
    10.1109/JSSC.2014.2338860
  • Filename
    6867375