DocumentCode
2167147
Title
Electroless plating of optical fibers for hermetic feedthrough seals
Author
Watson, James E. ; Shreve, Gary A. ; Miller, Michael N. ; Stevens, Daniel ; Sykora, Craig ; LaBella, David ; Ostby, Kevin ; Smith, Wiley K.
Author_Institution
3M Fiber Opt. & Electron. Mater. Technol. Center, St. Paul, MN, USA
fYear
2000
fDate
2000
Firstpage
250
Lastpage
255
Abstract
This paper describes an approach to plating solderable Ni-P metal on a fiber and sealing it into a Kovar ferrule. We demonstrate long-term reliability of the resulting soldered joint by detailed measurement of the fiber and joint strength before and after accelerated aging. We present evidence that the initial weakening of the fiber is caused by the plated metal itself, that failure of the metal film initiates fracture of the fiber. To support this, we show that embrittling the metal by heat treatment further reduces the strength of the metallized fiber. Since we intended to use the process on polarization-maintaining fibers, which are sensitive to stresses, we used a soft solder to make the hermetic seal. The joint strength is limited by the shear strength of the soft solder; use of a Au/Sn eutectic (m.p. of 280°C) probably results in embrittlement of the Ni-P and limited increase in strength
Keywords
brittle fracture; electroless deposition; encapsulation; nickel alloys; optical fibre cladding; phosphorus alloys; reliability; seals (stoppers); shear strength; soldering; Kovar ferrule; NiP; accelerated aging; electroless plating; encapsulation; failure model; fiber fracture; fiber strength; heat treatment; hermetic feedthrough seals; joint strength; long-term reliability; metal embrittlement; optical fibers; polarization-maintaining fibers; shear strength; soft solder; solderable Ni-P metal; soldered joint; Etching; Glass; Gold; Optical buffering; Optical fiber polarization; Optical fibers; Packaging; Polymer films; Seals; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853158
Filename
853158
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