Bandwidth prediction for high-performance interconnections

Author

Deutsch, A. ; Kopcsay, G.V. ; Coteus, P.W. ; Surovic, C.W. ; Dahlen, P. ; Heckmann, D.L. ; Duan, D.W.

Author_Institution

IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

fYear

2000

fDate

2000

Firstpage

256

Lastpage

266

Abstract

This paper compares the major classes of chip-to-chip and on-chips interconnections used in high-performance computers and communication systems. Measurement of dielectric loss is shown and the attenuation is compared for printed-circuit-board, glass-ceramic, thin-film, and on-chip wiring. Simulation results are shown with representative driver and receiver circuits, guidelines are formulated for when losses are significant, and predictions are made for the sustainable bandwidths on useful wiring lengths

Keywords

dielectric losses; driver circuits; integrated circuit packaging; interconnections; multichip modules; printed circuits; wiring; MCM; attenuation; bandwidth prediction; chip carriers; chip-to-chip interconnections; dielectric loss; digital applications; driver circuits; glass-ceramic; high-density interconnections; high-performance interconnections; ideal upper bound; on-chip wiring; on-chips interconnections; packaging density; printed-circuit-board; pulse distortion; receiver circuits; signal propagation delay; skin effect; thin-film; Attenuation measurement; Bandwidth; Dielectric loss measurement; Dielectric losses; Dielectric measurements; Integrated circuit interconnections; Loss measurement; Semiconductor device measurement; System-on-a-chip; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-5908-9

Type

conf

DOI

10.1109/ECTC.2000.853160

Filename

853160