DocumentCode
2167429
Title
Investigation on effect of coupling agents in epoxy based underfill material for flip chip application
Author
Luo, Shijian ; Wong, C.P.
Author_Institution
Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
2000
fDate
2000
Firstpage
311
Lastpage
318
Abstract
Underfill material is used in flip chip assembly to improve the solder joint fatigue lifetime. The adhesion between underfill material and passivation layer on integrated circuit chip as well as substrate is critical to the reliability of flip chip assembly. In order to improve the adhesion property of the underfill, the coupling agents are widely used. In this study, three different silane coupling agents, two titanate coupling agents, and one zirconate coupling agents were added into an epoxy underfill material, and their effects on the various properties of underfill were investigated
Keywords
adhesion; encapsulation; flip-chip devices; adhesion; coupling agent; epoxy underfill material; flip-chip assembly; Adhesives; Assembly; Coupling circuits; Fatigue; Flip chip; Integrated circuit reliability; Joining materials; Materials reliability; Passivation; Soldering;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853169
Filename
853169
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