DocumentCode :
2168109
Title :
High speed, high performance laser module
Author :
Benzoni, Albert ; Downie, Mark ; Kasper, Bryan ; Paslaski, Joel ; Peral, Eva ; Wu, Xin Mei ; Schrans, Thomas ; Swass, Matt ; Tsai, Charles ; Ury, Israel
Author_Institution :
Ortel Corp., Alhambra, CA, USA
fYear :
2000
fDate :
2000
Firstpage :
465
Lastpage :
468
Abstract :
We will present the performance data and discuss a few pertinent design details of a cooled directly modulated laser (DML) module that is targeted for use in several SONET OC-192 applications and capable of addressing 10G Ethernet requirements. The intent of the presentation is to demonstrate the performance potential of the module operating at 1310 nm wavelength for these applications. The four primary technical areas of focus are: (1) the ability to continuously operate in adverse environmental conditions, i.e. 85°C case temperature, (2) demonstrate transmission up to 80 km is achievable via use of, (3) a high efficiency optical coupling design, and (4) ease of RF interface due to low RF return loss and high bandwidth. These all assume that the laser´s intrinsic design is properly specified and well matched to the package design. The regime of engineering design is approaching the practical limits and diminishing returns in terms of RF and optical coupling efficiencies. This suggests that further substantial improvements require a change in the underlying technology
Keywords :
SONET; distributed feedback lasers; modules; optical fibre LAN; optical losses; optical transmitters; semiconductor device packaging; semiconductor lasers; 10 Gbit/s; 1310 nm; 80 km; 85 degC; DFB lasers; Ethernet requirements; RF return loss; SONET OC-192 applications; adverse environmental conditions; cooled directly modulated laser module; coupling efficiencies; engineering design; optical coupling design; optical transmitters; package design; Bandwidth; Ethernet networks; Optical coupling; Optical design; Optical losses; Packaging; Propagation losses; Radio frequency; SONET; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
Type :
conf
DOI :
10.1109/ECTC.2000.853197
Filename :
853197
Link To Document :
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