• DocumentCode
    2168135
  • Title

    A review of the new thermoelectric materials

  • Author

    Goldsmid, H.J. ; Nolas, G.S.

  • Author_Institution
    Sch. of Phys., New South Wales Univ., Sydney, NSW, Australia
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Most of the materials that are used in today´s thermoelectric generators and refrigerators were first developed many years ago. However, during the last decade promising results have been reported for several new systems of compounds and alloys. These include the skutterudites, the clathrates and the half-Heusler alloys. There are also a number of layer-structured compounds, some of which may be regarded as developments of the bismuth telluride system. Certain of these materials seem to possess the highest known figures of merit at least at elevated temperatures. Moreover, it is doubtful that any of the new systems have yet been fully optimized. The problem is that there are large numbers of compounds that remain to be investigated. Here we shall try to formulate some principles that will allow us to select those systems that are likely to yield the best long-term results. We discuss, for example, whether it is better for a material to have a high power factor or a low lattice thermal conductivity. We also consider the relative worth of a large or small effective mass for the charge carriers. Then, of course, one must take account of problems associated with the structure and preparation of the materials. The potential of the new materials for use as low-dimensional thermoelectrics will be included in our discussion
  • Keywords
    carrier mobility; effective mass; thermal conductivity; thermoelectricity; carrier mobility; effective mass; figure of merit; half-Heusler compounds; lattice thermal conductivity; low-dimensional thermoelectrics; power factor; preparation; skutterudites; thermoelectric materials; Bismuth; Conducting materials; Effective mass; Lattices; Reactive power; Refrigerators; Temperature; Thermal conductivity; Thermal factors; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
  • Conference_Location
    Beijing
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-7205-0
  • Type

    conf

  • DOI
    10.1109/ICT.2001.979602
  • Filename
    979602