High-frequency electrical performance of a new high-density multiple line grid array (MLGA) package

In this paper, we firstly introduce a new type of high-density package, called as Multiple Line Grid Array (MLGA) package. The MLGA package is developed as a strong candidate for next-generation, cost-effective, and high-density package manufactured by GLOTECH Inc. Moreover, the MLGA package not only provides excellent electrical transfer characteristics for high-frequency applications over 10 GHz, but also has improved thermal conductance of heat dissipation. We used the model parameter extraction procedure using network analyzer HP8510 and cascade probe, and the cascade transmission matrix conversion was performed to extract the equivalent circuit model parameters of the MLGA package. Two types of the MLGA packages were fabricated using ceramic and polymer. As a result of the model parameter extraction, the parasitic inductance and the parasitic capacitance were shown to be less than 0.34 nH and 0.33 pF, respectively for the MLGA package of 500 μm height, demonstrating the applications in the frequency range of over 10 GHz