A measurement and simulation study of transmission lines on microstrip and stacked-pair structure for high speed signals

Author

Odate, Yasuhiko ; Usami, Tamotsu ; Otsuka, Kanji ; Suga, Tadatomo

Author_Institution

Res. Center for Adv. Sci. & Technol., Tokyo Univ., Japan

fYear

2000

fDate

2000

Firstpage

526

Lastpage

529

Abstract

In high frequency transmission, crosstalk toward neighbor lines increases because of the strong behavior of electric and magnetic field. In this paper, we present a new transmission structure especially focused on the bus between CPU and memory for high frequency range. And we confirm the superiority of new structure through measurement and simulation study in terms of electromagnetic field analysis

Keywords

crosstalk; electromagnetic compatibility; electromagnetic fields; finite difference time-domain analysis; high-speed techniques; microstrip lines; waveguide theory; FDTD; crosstalk; electric field; electromagnetic field analysis; front side bus; high frequency transmission; high speed signals; magnetic field; measurement; microstrip; simulation; stacked-pair structure; transmission lines; Computational modeling; Crosstalk; Electric variables measurement; Electromagnetic fields; Electromagnetic measurements; Frequency measurement; Magnetic field measurement; Microstrip components; Transmission line measurements; Velocity measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th

Conference_Location

Las Vegas, NV

Print_ISBN

0-7803-5908-9

Type

conf

DOI

10.1109/ECTC.2000.853208

Filename

853208