• DocumentCode
    2168488
  • Title

    Thermoelectric property characterization of low-dimensional structures

  • Author

    Chen, G. ; Yang, B. ; Liu, W.L. ; Borca-Tasciuc, T. ; Song, D. ; Achimov, D. ; Dresselhaus, M.S. ; Liu, J.L. ; Wang, K.

  • Author_Institution
    Mech. & Aerosp. Eng. Dept., California Univ., Los Angeles, CA, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    30
  • Lastpage
    34
  • Abstract
    Thermoelectric property characterization of low-dimensional structures is a very challenging task. We will discuss issues encountered in the characterization of thermoelectric properties of low-dimensional structures, particularly thin film structures and their possible solutions. Emphasis is placed on measuring the thermoelectric properties in the same direction, i.e., either parallel or perpendicular to the thin-film plane. Our focus has been on Si/Ge superlattices that are grown by molecular beam epitaxy (MBE). These samples are typically grown on graded buffers, due to the lattice constant mismatch between Si and Ge, which significantly complicate the measurements, since the properties of the buffers are also unknown
  • Keywords
    Seebeck effect; electrical conductivity measurement; elemental semiconductors; germanium; semiconductor superlattices; silicon; thermal conductivity measurement; thermoelectricity; MBE; Seebeck coefficient measurement; Si-Ge; Si/Ge superlattices; electrical conductivity; graded buffers; lattice constant mismatch; low-dimensional structures; molecular beam epitaxy; same direction measurements; thermal conductivity; thermoelectric property characterization; thin film structures; Anisotropic conductive films; Anisotropic magnetoresistance; Conductivity measurement; Electric variables measurement; Substrates; Superlattices; Thermal conductivity; Thermoelectricity; Transistors; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2001. Proceedings ICT 2001. XX International Conference on
  • Conference_Location
    Beijing
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-7205-0
  • Type

    conf

  • DOI
    10.1109/ICT.2001.979616
  • Filename
    979616