DocumentCode
2168773
Title
SRAM memory cell leakage reduction design techniques in 65nm low power PD-SOI CMOS
Author
Thomas, Olivier ; Belleville, Marc ; Ferrant, Richard
Author_Institution
CEA/LETI, Minatec, Grenoble
fYear
2008
fDate
2-4 June 2008
Firstpage
51
Lastpage
54
Abstract
The paper presents a detailed study on the idle leakage reduction techniques on partially depleted silicon-on-insulator (PD-SOI) CMOS SRAM. The most promising leakage reduction techniques that have been proposed are introduced, analyzed and compared into 65 nm low-power PD-SOI technology, taking into account all the SOI specific effect. Especially, it is shown that the leakage reduction techniques change the strength of individual cell transistor, thus modifying the cell stability during the first read access following a long period of idle mode. The conclusions of the paper show that letting the bit lines float during the idle mode is mandatory to diminish the cell leakage current and help to protect the cell content against the bit-line aggressions.
Keywords
CMOS integrated circuits; SRAM chips; leakage currents; low-power electronics; silicon-on-insulator; PD-SOI CMOS; SOI specific effect; SRAM memory cell; bit-line aggressions; cell leakage current; cell stability; cell transistor; leakage reduction design techniques; partially depleted silicon-on-insulator CMOS SRAM; size 65 nm; CMOS technology; Circuit stability; IEEE members; Leakage current; Microelectronics; Protection; Random access memory; Threshold voltage; Transistors; Voltage control;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-1810-7
Electronic_ISBN
978-1-4244-1811-4
Type
conf
DOI
10.1109/ICICDT.2008.4567244
Filename
4567244
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