• DocumentCode
    2168773
  • Title

    SRAM memory cell leakage reduction design techniques in 65nm low power PD-SOI CMOS

  • Author

    Thomas, Olivier ; Belleville, Marc ; Ferrant, Richard

  • Author_Institution
    CEA/LETI, Minatec, Grenoble
  • fYear
    2008
  • fDate
    2-4 June 2008
  • Firstpage
    51
  • Lastpage
    54
  • Abstract
    The paper presents a detailed study on the idle leakage reduction techniques on partially depleted silicon-on-insulator (PD-SOI) CMOS SRAM. The most promising leakage reduction techniques that have been proposed are introduced, analyzed and compared into 65 nm low-power PD-SOI technology, taking into account all the SOI specific effect. Especially, it is shown that the leakage reduction techniques change the strength of individual cell transistor, thus modifying the cell stability during the first read access following a long period of idle mode. The conclusions of the paper show that letting the bit lines float during the idle mode is mandatory to diminish the cell leakage current and help to protect the cell content against the bit-line aggressions.
  • Keywords
    CMOS integrated circuits; SRAM chips; leakage currents; low-power electronics; silicon-on-insulator; PD-SOI CMOS; SOI specific effect; SRAM memory cell; bit-line aggressions; cell leakage current; cell stability; cell transistor; leakage reduction design techniques; partially depleted silicon-on-insulator CMOS SRAM; size 65 nm; CMOS technology; Circuit stability; IEEE members; Leakage current; Microelectronics; Protection; Random access memory; Threshold voltage; Transistors; Voltage control;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-1810-7
  • Electronic_ISBN
    978-1-4244-1811-4
  • Type

    conf

  • DOI
    10.1109/ICICDT.2008.4567244
  • Filename
    4567244