Title :
Full 26GHZ MMIC Chipset for Telecom Applications in SMD-Type Packages
Author :
Beilenhoff, Klaus ; Quentin, Pierre ; Tranchant, Sylvie ; Vaudescal, Olivier ; Parisot, Marc ; Daembkes, Heinrich
Author_Institution :
United Monolithic Semiconductors S.A.S., Route Departmentale 128 - BP 46, 91401 Orsay Cedex, France. Email: k.beilenhoff@ieee.org
Abstract :
In this paper of full 26GHz monolithic microwave integrated circuit (MMIC) chip set for telecom application assembled in SMD type packages is presented which allows a significant cost reduction for RF module assembly. The performances of these devices as well as cost issues concerning module assembly are addressed in this paper.
Keywords :
Application specific integrated circuits; Assembly; Costs; Integrated circuit packaging; MMICs; Microwave devices; Microwave integrated circuits; Monolithic integrated circuits; Radiofrequency integrated circuits; Telecommunications;
Conference_Titel :
Microwave Conference, 2002. 32nd European
Conference_Location :
Milan, Italy
DOI :
10.1109/EUMA.2002.339234
