• DocumentCode
    2169223
  • Title

    Full 26GHZ MMIC Chipset for Telecom Applications in SMD-Type Packages

  • Author

    Beilenhoff, Klaus ; Quentin, Pierre ; Tranchant, Sylvie ; Vaudescal, Olivier ; Parisot, Marc ; Daembkes, Heinrich

  • Author_Institution
    United Monolithic Semiconductors S.A.S., Route Departmentale 128 - BP 46, 91401 Orsay Cedex, France. Email: k.beilenhoff@ieee.org
  • fYear
    2002
  • fDate
    23-26 Sept. 2002
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper of full 26GHz monolithic microwave integrated circuit (MMIC) chip set for telecom application assembled in SMD type packages is presented which allows a significant cost reduction for RF module assembly. The performances of these devices as well as cost issues concerning module assembly are addressed in this paper.
  • Keywords
    Application specific integrated circuits; Assembly; Costs; Integrated circuit packaging; MMICs; Microwave devices; Microwave integrated circuits; Monolithic integrated circuits; Radiofrequency integrated circuits; Telecommunications;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference, 2002. 32nd European
  • Conference_Location
    Milan, Italy
  • Type

    conf

  • DOI
    10.1109/EUMA.2002.339234
  • Filename
    4140314
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2169223