• DocumentCode
    2169326
  • Title

    An In-Depth Investigation of Physical Mechanisms Governing SANOS Memories Characteristics

  • Author

    Bocquet, M. ; Vianello, E. ; Molas, G. ; Perniola, L. ; Grampeix, H. ; Martin, F. ; Colonna, J.P. ; Papon, A.M. ; Brianceau, P. ; Gély, M. ; De Salvo, B. ; Pananakakis, G. ; Ghibaudo, G. ; Selmi, L.

  • Author_Institution
    CEA, MINATEC, Grenoble
  • fYear
    2009
  • fDate
    10-14 May 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The goal of this work is to give a clear physical comprehension of the charge loss mechanisms of SANOS (Si/Al2O3/Si3N4/SiO2/Si) memories. Retention at room and high temperature is investigated on different samples through experiments and theoretical modeling. We argue that at room temperature, the charge loss essentially results from the tunneling of the electrons trapped at the nitride interface, and the retention life time increases with the nitride thickness. On the contrary, at high temperature, the trapped charges in the nitride volume quickly redistribute, thanks to the thermal emission process, and they migrate to the nitride interface. Indeed, this result suggests that thin-nitride thicknesses in SANOS devices allow keeping a fast program/erase speed without degrading the retention at high temperature.
  • Keywords
    aluminium compounds; elemental semiconductors; integrated memory circuits; silicon; silicon compounds; transistors; tunnelling; SANOS memories; Si-Al2O3-Si3N4-SiO2-Si; charge loss; charge trapping; electron trapping; high temperature retention; nitride interface; retention lifetime; room temperature retention; temperature 293 K to 298 K; thermal emission; tunneling; Aluminum oxide; Atomic layer deposition; Electron traps; Nonvolatile memory; Stress; Temperature; Thermal degradation; Tunneling; Water;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Memory Workshop, 2009. IMW '09. IEEE International
  • Conference_Location
    Monterey, CA
  • Print_ISBN
    978-1-4244-3762-7
  • Type

    conf

  • DOI
    10.1109/IMW.2009.5090579
  • Filename
    5090579