Title :
DC-to-20 GHz Metal-to-Metal Contact Flip Chip Assembly Shunt MEMS Switch
Author :
Yassini, Bahram ; Zybura, Andre ; Choi, Savio ; Yu, Ming
Author_Institution :
COM DEV Ltd, 155 Sheldon Drive, Cambridge, Ontario, N1R 7H6, Canada
Abstract :
A novel flip chip assembly MEMS shunt switch is reported. The MEMS device is flip chip attached on a microstrip circuit with Alumina substrate and released. A first electro-static actuated metal-to-metal contact shunt switch using flip chip process is produced with excellent RF performance.
Keywords :
Assembly; Circuits; Contacts; Flip chip; Microelectromechanical devices; Micromechanical devices; Microstrip; Microswitches; Radio frequency; Switches;
Conference_Titel :
Microwave Conference, 2002. 32nd European
Conference_Location :
Milan, Italy
DOI :
10.1109/EUMA.2002.339239
