Title :
Introduction to global norms in thermal problems
Author :
Jordan, A.J. ; Butrylo, B. ; Skorek, A.
Author_Institution :
Dept. of Electrotech. & Metrol., Tech. Univ. Bialystok, Poland
Abstract :
The paper presents a new approach in investigating optimal placement of electronic devices (e.g. thyristors) on the radiator. A minimum of a global norm being a linear combination of local norms which define the temperature field in the silicon junction of the thyristor was investigated. The weight coefficients of the global norm were made dependent on the power dissipated in the source region of the thyristor. The results of the numerical simulation were verified by the thermocouple method
Keywords :
numerical analysis; packaging; temperature distribution; thyristors; electronic device optimal placement; global norms; numerical simulation; power dissipation; radiator; silicon junction; source region; temperature field; thermal problems; thermocouple method; thyristors; weight coefficients; Electronics industry; Employment; Finite element methods; Functional analysis; Industrial electronics; Metrology; Silicon; Temperature distribution; Thyristors;
Conference_Titel :
Electrical and Computer Engineering, 1993. Canadian Conference on
Conference_Location :
Vancouver, BC
Print_ISBN :
0-7803-2416-1
DOI :
10.1109/CCECE.1993.332316
