DocumentCode
2169802
Title
Introduction to global norms in thermal problems
Author
Jordan, A.J. ; Butrylo, B. ; Skorek, A.
Author_Institution
Dept. of Electrotech. & Metrol., Tech. Univ. Bialystok, Poland
fYear
1993
fDate
14-17 Sep 1993
Firstpage
301
Abstract
The paper presents a new approach in investigating optimal placement of electronic devices (e.g. thyristors) on the radiator. A minimum of a global norm being a linear combination of local norms which define the temperature field in the silicon junction of the thyristor was investigated. The weight coefficients of the global norm were made dependent on the power dissipated in the source region of the thyristor. The results of the numerical simulation were verified by the thermocouple method
Keywords
numerical analysis; packaging; temperature distribution; thyristors; electronic device optimal placement; global norms; numerical simulation; power dissipation; radiator; silicon junction; source region; temperature field; thermal problems; thermocouple method; thyristors; weight coefficients; Electronics industry; Employment; Finite element methods; Functional analysis; Industrial electronics; Metrology; Silicon; Temperature distribution; Thyristors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical and Computer Engineering, 1993. Canadian Conference on
Conference_Location
Vancouver, BC
Print_ISBN
0-7803-2416-1
Type
conf
DOI
10.1109/CCECE.1993.332316
Filename
332316
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