Integration of SAW filters

Author

Hdiji, Tarak ; Mnif, Hassene ; Loulou, Mourad

Author_Institution

LETI, Electron. & Inf. Technol. Lab., Nat. Eng. Sch. of Sfax, Sfax

fYear

2008

fDate

2-4 June 2008

Firstpage

245

Lastpage

248

Abstract

Advances in micromachining technology can facilitate the integration of SAW (Surface Acoustic Wave) devices and CMOS circuitry on IC scale substrate for Monolithic fabrication. The optimal design and performance of these filters can be reached by using new Smart materials. The key component in the structure of the SAW device is the piezoelectric materials used which depends mainly on some important properties such as, high acoustic velocities, power durability and temperature stability. Simulation results are presented for different design of SAW filter and different piezoelectric substrates.

Keywords

CMOS integrated circuits; intelligent materials; micromachining; piezoelectric materials; surface acoustic wave filters; CMOS circuitry; IC scale substrate; SAW device; SAW filters; acoustic velocities; micromachining technology; monolithic fabrication; monolithic integrated circuit; piezoelectric materials; piezoelectric substrates; power durability; smart materials; surface acoustic wave devices; temperature stability; Acoustic waves; CMOS integrated circuits; CMOS technology; Fabrication; Micromachining; Microwave integrated circuits; Monolithic integrated circuits; SAW filters; Surface acoustic wave devices; Surface acoustic waves; Micromachining; Monolithic IC; SAW; Smart materials;

fLanguage

English

Publisher

ieee

Conference_Titel

Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on

Conference_Location

Austin, TX

Print_ISBN

978-1-4244-1810-7

Electronic_ISBN

978-1-4244-1811-4

Type

conf

DOI

10.1109/ICICDT.2008.4567287

Filename

4567287