DocumentCode :
2170243
Title :
Analysis of a borderless fab scenario in a distributed simulation testbed
Author :
Lendermann, Peter ; Ping Gan, Boon ; Loh, Yoon Loong ; Tan, Hiap Keong ; Lieu, Sip Khean ; Fowler, John W. ; McGinnis, Leon F.
Author_Institution :
Production & Logistics Planning Group, Singapore Inst. of Manuf. Technol., Singapore
Volume :
2
fYear :
2004
fDate :
5-8 Dec. 2004
Firstpage :
1896
Abstract :
Distributed simulation based on the High Level Architecture standard is adopted to realize the simulation of a borderless fab that involves two wafer fabs located in close proximity. The two fabs pool together their resources for capacity sharing. To demonstrate the benefits of this concept, experiments were conducted to measure the cycle time changes resulting from introduction of an additional product into either one of the fabs. In the case without cross fab material flow, the capacity of each fab alone is not sufficient to handle the increasing release rate of the new product as bottleneck machines surface. However, for the cross fab case where the front-end of the new product´s process is done in the first fab, while the back-end in the second, it is possible to avoid the bottleneck situation. As a result, the two fabs are able to increase their aggregated capacity without investing in new equipment.
Keywords :
digital simulation; electronic engineering computing; integrated circuit manufacture; manufacturing resources planning; production engineering computing; High Level Architecture standard; borderless fab scenario; capacity sharing; cycle time changes; distributed simulation; fab material flow; product process; wafer fabs; Analytical models; Assembly; Gallium nitride; Production planning; Pulp manufacturing; Semiconductor device manufacture; Semiconductor device modeling; Software testing; System testing; Virtual manufacturing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Simulation Conference, 2004. Proceedings of the 2004 Winter
Print_ISBN :
0-7803-8786-4
Type :
conf
DOI :
10.1109/WSC.2004.1371546
Filename :
1371546
Link To Document :
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