• DocumentCode
    2170298
  • Title

    How does inversed temperature dependence affect timing sign-off

  • Author

    Wu, Sean H. ; Tetelbaum, Alexander ; Wang, Li.-C.

  • Author_Institution
    LSI Corp., Milpitas, CA
  • fYear
    2008
  • fDate
    2-4 June 2008
  • Firstpage
    297
  • Lastpage
    300
  • Abstract
    As mainstream processing technology advances into 65 nm and beyond, many factors that were previously considered secondary or insignificant, can now have an impact on chip timing. One of these factor is inversed temperature dependence (ITD). As supply voltage continues scaling into sub-IV territory, delay-temperature relationship can be reversed on some cells, meaning that device switching time may decrease as temperature increases. ITD posts a new challenge for timing sign-off because the highest and lowest sign-off temperatures may no longer be the worst-case and best-case timing corners. This work discuss the effect of ITD and its implication on timing sign-off, based on a standard cell library used in a typical design flow.
  • Keywords
    logic design; low-power electronics; timing; cell library; delay-temperature relationship; inversed temperature dependence; sub-IV territory; timing sign-off; Circuits; Delay effects; Electron mobility; Large scale integration; Libraries; Low voltage; Propagation delay; Temperature dependence; Temperature sensors; Timing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
  • Conference_Location
    Austin, TX
  • Print_ISBN
    978-1-4244-1810-7
  • Electronic_ISBN
    978-1-4244-1811-4
  • Type

    conf

  • DOI
    10.1109/ICICDT.2008.4567300
  • Filename
    4567300