DocumentCode
2170298
Title
How does inversed temperature dependence affect timing sign-off
Author
Wu, Sean H. ; Tetelbaum, Alexander ; Wang, Li.-C.
Author_Institution
LSI Corp., Milpitas, CA
fYear
2008
fDate
2-4 June 2008
Firstpage
297
Lastpage
300
Abstract
As mainstream processing technology advances into 65 nm and beyond, many factors that were previously considered secondary or insignificant, can now have an impact on chip timing. One of these factor is inversed temperature dependence (ITD). As supply voltage continues scaling into sub-IV territory, delay-temperature relationship can be reversed on some cells, meaning that device switching time may decrease as temperature increases. ITD posts a new challenge for timing sign-off because the highest and lowest sign-off temperatures may no longer be the worst-case and best-case timing corners. This work discuss the effect of ITD and its implication on timing sign-off, based on a standard cell library used in a typical design flow.
Keywords
logic design; low-power electronics; timing; cell library; delay-temperature relationship; inversed temperature dependence; sub-IV territory; timing sign-off; Circuits; Delay effects; Electron mobility; Large scale integration; Libraries; Low voltage; Propagation delay; Temperature dependence; Temperature sensors; Timing;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Circuit Design and Technology and Tutorial, 2008. ICICDT 2008. IEEE International Conference on
Conference_Location
Austin, TX
Print_ISBN
978-1-4244-1810-7
Electronic_ISBN
978-1-4244-1811-4
Type
conf
DOI
10.1109/ICICDT.2008.4567300
Filename
4567300
Link To Document