• DocumentCode
    2170366
  • Title

    Curriculum Development and Progressive Engineering Practice Design in Embed System Education

  • Author

    Xiaojuan, Li ; Yong, Guan ; Huimei, Yuan

  • Author_Institution
    Coll. of Inf. Eng., Capital Normal Univ., Beijing
  • fYear
    2008
  • fDate
    12-15 Oct. 2008
  • Firstpage
    228
  • Lastpage
    232
  • Abstract
    The development of courses system for embed system and the exploration of realistic embedded systems design experience for students are described in the paper. The design pay more attention on developing students´s professional skills that will serve students well in their careers besides the requisite related basic theory. The curriculum design is shaped into two technology courses mainstreams, one is for universal processors system and the other focus on system on programmable chip (SOPC), a novel schedule of embedded systems education with professional engineering practice and progressive cooperative experiential learning is putted forward. The effect of the schedule from lecturers´ response and student´s assessment comments show that it is effective to develop the student´s engineering practice, teamwork and active-learning skills.
  • Keywords
    computer science education; educational courses; electronic engineering computing; electronic engineering education; embedded systems; microcontrollers; system-on-chip; SOPC; curriculum development; educational course; embedded system education; progressive cooperative experiential learning; progressive engineering practice design; system-on-programmable chip; universal processor system; Curriculum development; Design engineering; Embedded computing; Embedded software; Embedded system; Engineering profession; Processor scheduling; Software design; Systems engineering and theory; Systems engineering education; Professional engineering practice; course design; embeded system curriculum; progressive experience;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Mechtronic and Embedded Systems and Applications, 2008. MESA 2008. IEEE/ASME International Conference on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-2367-5
  • Electronic_ISBN
    978-1-4244-2368-2
  • Type

    conf

  • DOI
    10.1109/MESA.2008.4735752
  • Filename
    4735752