DocumentCode
2170366
Title
Curriculum Development and Progressive Engineering Practice Design in Embed System Education
Author
Xiaojuan, Li ; Yong, Guan ; Huimei, Yuan
Author_Institution
Coll. of Inf. Eng., Capital Normal Univ., Beijing
fYear
2008
fDate
12-15 Oct. 2008
Firstpage
228
Lastpage
232
Abstract
The development of courses system for embed system and the exploration of realistic embedded systems design experience for students are described in the paper. The design pay more attention on developing students´s professional skills that will serve students well in their careers besides the requisite related basic theory. The curriculum design is shaped into two technology courses mainstreams, one is for universal processors system and the other focus on system on programmable chip (SOPC), a novel schedule of embedded systems education with professional engineering practice and progressive cooperative experiential learning is putted forward. The effect of the schedule from lecturers´ response and student´s assessment comments show that it is effective to develop the student´s engineering practice, teamwork and active-learning skills.
Keywords
computer science education; educational courses; electronic engineering computing; electronic engineering education; embedded systems; microcontrollers; system-on-chip; SOPC; curriculum development; educational course; embedded system education; progressive cooperative experiential learning; progressive engineering practice design; system-on-programmable chip; universal processor system; Curriculum development; Design engineering; Embedded computing; Embedded software; Embedded system; Engineering profession; Processor scheduling; Software design; Systems engineering and theory; Systems engineering education; Professional engineering practice; course design; embeded system curriculum; progressive experience;
fLanguage
English
Publisher
ieee
Conference_Titel
Mechtronic and Embedded Systems and Applications, 2008. MESA 2008. IEEE/ASME International Conference on
Conference_Location
Beijing
Print_ISBN
978-1-4244-2367-5
Electronic_ISBN
978-1-4244-2368-2
Type
conf
DOI
10.1109/MESA.2008.4735752
Filename
4735752
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