DocumentCode :
2170372
Title :
Quality of SOI film after surface smoothing with hydrogen annealing, touch-polishing
Author :
Maszara, W.P. ; Gondran, C.F.H. ; Jackett-Murphy, S. ; Vasudev, P.K. ; Iyer, S.S. ; Anc, M.J.
Author_Institution :
SEMATECH, Austin, TX, USA
fYear :
1997
fDate :
6-9 Oct 1997
Firstpage :
130
Lastpage :
131
Abstract :
We have conducted an investigation to evaluate the impact of both touch-polish and hydrogen annealing at different temperatures on the roughness, on the SOI film removal, as well as the impact of so processed surface on the integrity of gate oxide thermally grown on it, for SIMOX and BESOI material
Keywords :
SIMOX; annealing; polishing; silicon-on-insulator; surface topography; BESOI material; H2; SIMOX material; SOI film; hydrogen annealing; roughness; surface smoothing; thermal gate oxide; touch polishing; Annealing; Atomic measurements; Hydrogen; Rough surfaces; Silicon; Smoothing methods; Surface morphology; Surface roughness; Temperature; Wafer bonding;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 1997. Proceedings., 1997 IEEE International
Conference_Location :
Fish Camp, CA
ISSN :
1078-621X
Print_ISBN :
0-7803-3938-X
Type :
conf
DOI :
10.1109/SOI.1997.634967
Filename :
634967
Link To Document :
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