DocumentCode :
2170466
Title :
1991 Proceedings. International Conference on Wafer Scale Integration (Cat. No.91CH2943-9)
fYear :
1991
fDate :
29-31 Jan. 1991
Abstract :
The following topics are dealt with: WSI (wafer scale integration) architecture and devices; defect tolerance; reconfiguration; defect modeling and yield; technology for WSI; WSI networks; and testing for WSI
Keywords :
VLSI; integrated circuit technology; integrated circuit testing; monolithic integrated circuits; parallel architectures; semiconductor device models; WSI; WSI networks; defect modeling; defect tolerance; reconfiguration; testing; wafer scale integration; yield;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Wafer Scale Integration, 1991. Proceedings., [3rd] International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-8186-9126-3
Type :
conf
DOI :
10.1109/ICWSI.1991.151736
Filename :
151736
Link To Document :
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