• DocumentCode
    2170685
  • Title

    Modeling alignment shift of soldered optical fiber

  • Author

    Powell, Adam

  • Author_Institution
    MIT, Cambridge, MA, USA
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    997
  • Lastpage
    1001
  • Abstract
    Solder is often used as an adhesive to attach optical fibers to a circuit board. In this proceeding we will discuss efforts to model the motion of an optical fiber during the wetting and solidification of the adhesive solder droplet. The extent of motion is determined by several competing forces, during three “stages” of solder joint formation. First, capillary forces of the liquid phase control the fiber position. Second, during solidification, the presence of the liquid-solid-vapor triple line as well as a reduced liquid solder volume leads to a change in the net capillary force on the optical fiber. Finally, the solidification front itself impinges on the fiber. Publicly-available finite element models are used to calculate the time-dependent position of the solidification front and shape of the free surface
  • Keywords
    adhesives; finite element analysis; optical fibres; soldering; adhesive; alignment shift; capillary force; circuit board; finite element model; liquid droplet; liquid-solid-vapor triple line; optical fiber attachment; solder joint formation; solidification; wetting; Cooling; Lead; Optical fiber communication; Optical fiber devices; Optical fibers; Printed circuits; Robustness; Shape; Soldering; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
  • Conference_Location
    Las Vegas, NV
  • Print_ISBN
    0-7803-5908-9
  • Type

    conf

  • DOI
    10.1109/ECTC.2000.853289
  • Filename
    853289