Title :
Modeling alignment shift of soldered optical fiber
Author_Institution :
MIT, Cambridge, MA, USA
Abstract :
Solder is often used as an adhesive to attach optical fibers to a circuit board. In this proceeding we will discuss efforts to model the motion of an optical fiber during the wetting and solidification of the adhesive solder droplet. The extent of motion is determined by several competing forces, during three “stages” of solder joint formation. First, capillary forces of the liquid phase control the fiber position. Second, during solidification, the presence of the liquid-solid-vapor triple line as well as a reduced liquid solder volume leads to a change in the net capillary force on the optical fiber. Finally, the solidification front itself impinges on the fiber. Publicly-available finite element models are used to calculate the time-dependent position of the solidification front and shape of the free surface
Keywords :
adhesives; finite element analysis; optical fibres; soldering; adhesive; alignment shift; capillary force; circuit board; finite element model; liquid droplet; liquid-solid-vapor triple line; optical fiber attachment; solder joint formation; solidification; wetting; Cooling; Lead; Optical fiber communication; Optical fiber devices; Optical fibers; Printed circuits; Robustness; Shape; Soldering; Solid modeling;
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
DOI :
10.1109/ECTC.2000.853289