DocumentCode
2170685
Title
Modeling alignment shift of soldered optical fiber
Author
Powell, Adam
Author_Institution
MIT, Cambridge, MA, USA
fYear
2000
fDate
2000
Firstpage
997
Lastpage
1001
Abstract
Solder is often used as an adhesive to attach optical fibers to a circuit board. In this proceeding we will discuss efforts to model the motion of an optical fiber during the wetting and solidification of the adhesive solder droplet. The extent of motion is determined by several competing forces, during three “stages” of solder joint formation. First, capillary forces of the liquid phase control the fiber position. Second, during solidification, the presence of the liquid-solid-vapor triple line as well as a reduced liquid solder volume leads to a change in the net capillary force on the optical fiber. Finally, the solidification front itself impinges on the fiber. Publicly-available finite element models are used to calculate the time-dependent position of the solidification front and shape of the free surface
Keywords
adhesives; finite element analysis; optical fibres; soldering; adhesive; alignment shift; capillary force; circuit board; finite element model; liquid droplet; liquid-solid-vapor triple line; optical fiber attachment; solder joint formation; solidification; wetting; Cooling; Lead; Optical fiber communication; Optical fiber devices; Optical fibers; Printed circuits; Robustness; Shape; Soldering; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853289
Filename
853289
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