DocumentCode
2170707
Title
Networking the electronics packaging education
Author
Illyefalvi-Vitéz, Zsolt ; Golonka, Leszek ; Mach, Pavel ; Nicolics, Johann ; Svasta, Paul
Author_Institution
Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary
fYear
2000
fDate
2000
Firstpage
1008
Lastpage
1015
Abstract
The development of information technology has opened new perspectives in spreading scientific information and in education as well. Studying the curricula of other universities, paying virtual visits to laboratories and departments, taking courses, training and examinations using the Internet became a reality by now and hopefully will be everyday practice in the future. In the field of electronics packaging education it is essential to use all these tools provided by information technology, in order to prepare engineers for the needs of the 21st century. A microelectronics packaging education network was established for the virtual integration of the activity of university departments in the Central European region, having already contact with each other in the form of the traditional International Spring Seminars on Electronics Technology
Keywords
electronic engineering education; packaging; Central Europe; Internet; Network Web; electronics packaging education; information technology; Educational technology; Electronics packaging; Europe; Information technology; Internet; Laboratories; Microelectronics; Natural languages; Seminars; Springs;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location
Las Vegas, NV
Print_ISBN
0-7803-5908-9
Type
conf
DOI
10.1109/ECTC.2000.853291
Filename
853291
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