Abstract :
The following topics are dealt with: test generation and fault simulation; software testing and reliability model; failure analysis and fault modelling; build-in self-test or embedded testing; yield enhancement and silicon debug; automatic test equipment; analog and mixed signal testing and RF/High speed I/O testing; delay fault testing; low power testing; system-on-a-chip test and system-in-package test; memory and FPGA testing; board and system testing/ online testing; and test economics/ functional verification/ failure analysis.
Keywords :
elemental semiconductors; fault simulation; field programmable gate arrays; functional analysis; program testing; reliability; silicon; system-on-chip; FPGA testing; RF-high speed I-O testing; analog signal testing; automatic test equipment; build-in self-test; delay fault testing; embedded testing; failure analysis; fault modelling; fault simulation; functional verification; low power testing; mixed signal testing; online testing; reliability model; silicon debug; software testing; system testing; system-in-package test; system-on-a-chip test; test economics; test generation; yield enhancement;
Conference_Titel :
Test Symposium (ATS), 2010 19th IEEE Asian
Conference_Location :
Shanghai
Print_ISBN :
978-1-4244-8841-4
