Title :
Co-simulation of ANSYS and Pro/E in thermal analysis of HB-LED lamp
Author :
Ju-hua, Li ; Jun-ming, Xu
Author_Institution :
Coll. of Electron. Inf., Hangzhou Dianzi Univ., Hangzhou, China
Abstract :
HB-LEDs (High brightness light emitting diodes) will bring great thermal problem, so thermal analysis and design are greatly needed for HB-LED lamp, or the luminous efficiency and LED working life will become lower. In this paper, finite element analysis software ANSYS and three-dimensional software Pro/E are used together for complicated lamp thermal analysis and design. 7W LED lamp is used as an example, the modeling of LED lamp is realized with Pro/E software, and then the model is imported into ANSYS for thermal simulation, to get the temperature distribution of LED lamp. The Pro/E is used because it has greater modeling ability than ANSYS for complicated LED lamp structures. The simulated results are compared with the measured temperature, and find the two results are similar. This process also can help to design new kinds of LED lamp.
Keywords :
LED lamps; electrical engineering computing; finite element analysis; thermal analysis; ANSYS-Pro/E cosimulation; finite element analysis; high brightness LED lamp; high brightness light emitting diode; thermal analysis; three dimensional software; Finite element methods; Heating; LED lamps; Solid modeling; Temperature distribution; Thermal analysis; ANSYS; HB-LED; Pro/E; junction temperature; thermal analysis;
Conference_Titel :
Electronics, Communications and Control (ICECC), 2011 International Conference on
Conference_Location :
Ningbo
Print_ISBN :
978-1-4577-0320-1
DOI :
10.1109/ICECC.2011.6066392
