• DocumentCode
    2171203
  • Title

    Silicon and III-V nanoelectronics

  • Author

    Datta, Suman ; Chau, Robert

  • Author_Institution
    Components Res., Intel Corp., Hillsboro, OR, USA
  • fYear
    2005
  • fDate
    8-12 May 2005
  • Firstpage
    7
  • Lastpage
    8
  • Abstract
    Sustaining Moore´s Law of doubling CMOS transistor density every twenty four months will require not only shrinking the transistor dimensions, but also introduction of new materials and new device architectures. We discuss in this talk the recent innovations that are being researched and pursued to enable high performance Si-based CMOS nanoelectronics such as the use of highly strained Si channel for enhanced carrier transport, high-K dielectric and metal gate stack for low gate leakage, and non-planar multiple gate transistors for reduced short channel effects. In the future, further power-performance benefit may even potentially be achieved by incorporating III-V compound semiconductor nanoelectronics as ultra-high channel mobility materials. Some novel benchmarking results comparing III-V transistors to state-of-the-art advanced Si transistors will be presented.
  • Keywords
    CMOS integrated circuits; III-V semiconductors; elemental semiconductors; nanoelectronics; semiconductor devices; silicon; CMOS transistor density; III-V nanoelectronics; III-V semiconductor compound; III-V transistors; Moores law; Si; Si channel; Si-based CMOS nanoelectronics; carrier transport; channel effects; device architectures; dielectric gate stack; gate leakage; metal gate stack; nonplanar multiple gate transistors; silicon; state-of-the-art Si transistors; ultra-high channel mobility materials; Dielectric materials; Gate leakage; High K dielectric materials; High-K gate dielectrics; III-V semiconductor materials; Moore´s Law; Nanoelectronics; Silicon; Technological innovation; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 2005. International Conference on
  • ISSN
    1092-8669
  • Print_ISBN
    0-7803-8891-7
  • Type

    conf

  • DOI
    10.1109/ICIPRM.2005.1517405
  • Filename
    1517405