Title :
Silicon and III-V nanoelectronics
Author :
Datta, Suman ; Chau, Robert
Author_Institution :
Components Res., Intel Corp., Hillsboro, OR, USA
Abstract :
Sustaining Moore´s Law of doubling CMOS transistor density every twenty four months will require not only shrinking the transistor dimensions, but also introduction of new materials and new device architectures. We discuss in this talk the recent innovations that are being researched and pursued to enable high performance Si-based CMOS nanoelectronics such as the use of highly strained Si channel for enhanced carrier transport, high-K dielectric and metal gate stack for low gate leakage, and non-planar multiple gate transistors for reduced short channel effects. In the future, further power-performance benefit may even potentially be achieved by incorporating III-V compound semiconductor nanoelectronics as ultra-high channel mobility materials. Some novel benchmarking results comparing III-V transistors to state-of-the-art advanced Si transistors will be presented.
Keywords :
CMOS integrated circuits; III-V semiconductors; elemental semiconductors; nanoelectronics; semiconductor devices; silicon; CMOS transistor density; III-V nanoelectronics; III-V semiconductor compound; III-V transistors; Moores law; Si; Si channel; Si-based CMOS nanoelectronics; carrier transport; channel effects; device architectures; dielectric gate stack; gate leakage; metal gate stack; nonplanar multiple gate transistors; silicon; state-of-the-art Si transistors; ultra-high channel mobility materials; Dielectric materials; Gate leakage; High K dielectric materials; High-K gate dielectrics; III-V semiconductor materials; Moore´s Law; Nanoelectronics; Silicon; Technological innovation; Transistors;
Conference_Titel :
Indium Phosphide and Related Materials, 2005. International Conference on
Print_ISBN :
0-7803-8891-7
DOI :
10.1109/ICIPRM.2005.1517405