Test architecture design and optimization for three-dimensional SoCs

Core-based system-on-chips (SoCs) fabricated on three-dimensional (3D) technology are emerging for better integration capabilities. Effective test architecture design and optimization techniques are essential to minimize the manufacturing cost for such giga-scale integrated circuits. In this paper, we propose novel test solutions for 3D SoCs manufactured with die-to-wafer and die-to-die bonding techniques. Both testing time and routing cost associated with the test access mechanisms in 3D SoCs are considered in our simulated annealing-based technique. Experimental results on ITC´02 SoC benchmark circuits are compared to those obtained with two baseline solutions, which show the effectiveness of the proposed technique.