DocumentCode :
2171899
Title :
ParaBIT-1: 60-Gb/s-throughput parallel optical interconnect module
Author :
Usui, Mitsuo ; Sato, Nobuo ; Ohki, Akira ; Matsuura, Nobuaki ; Tanaka, Nobuyuki ; Enbutsu, Koji ; Amano, Michiyuki ; Hikita, Makoto ; Kagawa, Toshiaki ; Katsura, Kohsuke ; Ando, Yasuhiro
Author_Institution :
NTT Telecommun. Energy Labs., Kanagawa, Japan
fYear :
2000
fDate :
2000
Firstpage :
1252
Lastpage :
1258
Abstract :
We previously proposed ParaBIT (parallel inter-board optical interconnection technology), and developed a prototype front-end module, called ParaBIT-0, with a total throughput of 28 Gb/s (700 Mb/s×40 ch). Aiming at higher throughput, lower cost, and further miniaturization, we are now developing a version, called ParaBIT-1, which is designed to achieve a total throughput of 60 Gb/s (1.25 Gbit/s×480-ch). To achieve a compact and high-throughput module, we developed a new compact high-density packaging structure and cost-effective optical coupling system for ParaBIT-1. This packaging structure enabled us to reduce the volume of ParaBIT-1 to 9 cc, which is about one-third that of ParaBIT-0 (25 cc). The optical coupling system consists of a new structure 24-fiber BF (bare fiber) connector whose main parts are made of molded plastic and a 24-channel optical coupling component using new polymeric optical waveguide film. The optical coupling component is composed of a 24-ch waveguide film with 45° mirrors and the 24-fiber BF connector interface, and can be assembled by passive alignment. The film has high thermal stability to allow soldering reflow processes, and is fabricated by direct photo-patterning. ParaBIT-1 met the design target of 1.25 Gb/s per channel
Keywords :
optical fibre couplers; optical interconnections; packaging; 60 Gbit/s; ParaBIT-1; bare fiber connector; optical coupling; packaging; parallel optical interconnect module; polymeric optical waveguide film; Connectors; Optical coupling; Optical films; Optical interconnections; Optical polymers; Optical waveguide components; Optical waveguides; Packaging; Polymer films; Throughput;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components & Technology Conference, 2000. 2000 Proceedings. 50th
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5908-9
Type :
conf
DOI :
10.1109/ECTC.2000.853334
Filename :
853334
Link To Document :
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