Title :
Simulation of signal propagation with prospective air gap architectures as potential solutions to achieve Moore´s law for the 32 nm node and below Cu Introduction of ULK
Author :
Blampey, B. ; Gallitre, M. ; Farcy, A. ; Gosset, L.G. ; Bermond, C. ; Fléchet, B. ; Torres, J.
Author_Institution :
LAHC, Univ. de Savoie, Le Bourget du Lac
Abstract :
The development of 32 nm node ICs face several integration and performance issues. Air gap architecture constitutes a potential alternative to porous materials. The most promising stacks are compared in terms of signal propagation thanks to electromagnetic simulations, showing that air gaps address the challenges for considered node
Keywords :
air gaps; integrated circuit interconnections; Moore law; air gap architectures; electromagnetic simulations; porous materials; signal propagation; Air gaps; Crosstalk; Delay; Dielectric materials; Dielectrics and electrical insulation; Electromagnetic propagation; Moore´s Law; Polymers; Research and development; Thermal degradation;
Conference_Titel :
Interconnect Technology Conference, 2006 International
Conference_Location :
Burlingame, CA
Print_ISBN :
1-4244-0104-6
DOI :
10.1109/IITC.2006.1648667
