Distance learning in thermal design of electronic systems - the IEEE/NSF project

A three-year collaborative effort initiated by three institutions has resulted in a new paradigm for distance learning in rapidly evolving technology areas, such as electronics packaging. From the start, the team emphasized the use of multi-media technology for creating and disseminating internet delivered, re-configurable, shared modular educational materials. These modules could be used in a stand-alone fashion for re-training, or embedded in existing courses in various curricula. Using these modules, the first offering of a one semester graduate course on thermal design of electronic systems was made during Spring 1999. This included participants not only from the three original universities, but also from the industry and other universities. This course was taught once a week for three hours, live over the internet. In addition, course materials asynchronously available on the web included Power Point slides of the notes, streaming video, computational codes and virtual laboratory tours. During the second offering of this course during Spring 2000, a number of additional features have been implemented, including expanded participation and greater collaboration. This paper will concentrate on the lessons learned from teaching the second generation of this course. Ongoing efforts involving module standardization will also be described